Laser removal of semiconductor links to correct errant design or re-direct conductive paths.
Solder mask removal
Electroplating link/shorting bar removal
Silicon, ceramic, plastic, SS / Al <0.005" thick
Al2O3 Ceramic <0.010"
Polyimide / Kapton
1st harmonic (1064nm) and 3rd harmonic (355nm) pulsed YAG laser systems
Spot size range = 3um - 50um (0.00015” - 0.002"),
Hole diameters <0.001” possible, material composition / thickness dependent
Read more about Laser Wafer Trimming
Aluminum Links on Silicon
