Thin Film, UTF Laser Resistor Trim

Passive and Active Laser Trimming:

• Resistor Array Networks (RAN)
• RF / Microwave circuitry
• TaN / NiCr / SiCr resistor films
• Silicon, Quartz, GaAs, Al2O3, and most current wafer or substrate materials.

Semiconductor link blowing (Aluminum, poly-silicon links)

Functional / Active laser trim & test: We will work with your engineering staff to develop custom applications software and wafer mapping, support circuitry / hardware and an optimized process for Functional / Active Laser Trimming & Test.

Ratio-Match and absolute Post-trim tolerances of +/-0.01% possible, resistor material and design dependent.

Highest verified trim nominal value = 500 Mega-ohm +/-5%, higher with custom fixturing. Lowest verified trim nominal value = 5 milli-ohm +/-5%

Read more about Laser Wafer Trimming